Mobile Phone Accessories

Surface acoustic wave device and method for making same and mobile phone having same

United States Patent 7327069 Chen February 5, 2008

A surface acoustic wave (SAW) device includes a silicon substrate, a piezoelectric layer on the substrate and two generally comb-shaped electrodes. The thickness of the piezoelectric layer is preferably configured to be in the range from about 0.05 .mu.m to about 2 .mu.m, and the grain size of the piezoelectric layer is preferably configured to be in the range from about 1 nm to about 50 nm. A mobile phone assembled at least two SAW devices therein, and a method for manufacturing a SAW device, are also provided.

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